Temperature shock test by ALP Thermal Shock Test chamber

Temperature shock test---From ALP technology

Use: Thermal shock test is used to test the material structure or composite material, in the instant under the continuous environment of high temperature and low temperature can tolerate the degree, suitable for electrical, electronic products, semiconductors, electronic circuit boards, metal materials and other materials in the rapid change of temperature environment adaptability. It can be used in the development stage to find product design and process defects, and in some cases can also be used for environmental stress screening to eliminate early product failures. The severity of the test depends on the high and low temperature range, dwell time, temperature transition time, and number of cycles.

Certification standards: meet GB/T2423.22 (IEC60068-2-14); ISO16750; IPC-TM-650; Temperature shock test in JESD22 and other series standards.

https://www.alp-environment.com/PRODUCT/Thermal-Shock-Test-Chamber.html